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CORNING PYREX SG3.3 is a borosilicate glass with a thermal expansion coefficient that matches that of silicon, effectively combines with silicon during anodic bonding, and has a thermal expansion rate that can withstand high temperatures and harsh environments. More importantly, since the CORNING PYREX SG3.3 contains an alkaline component, an efficient anodic bonding process can be achieved. When the temperature continues to rise up to 450 ºC,CORNING PYREX SG3.3 can still provide a consistent, bondable surface, do not need to distinguish between one side and the other side, through the use of industry standard bonding equipment, can be carried out without voids, low stress bonding, and ultimately produce strong and durable bonds, without the need for adhesives or excessive temperatures.
This product is specially designed for anodic bonding applications in the semiconductor and electronics industries and can withstand high temperatures and harsh environments. CORNING® PYREX® SG3.3 provides a consistent, bondable surface that eliminates the need to distinguish between front and back sides for void-free, low-stress bonding using industry-standard bonding equipment.
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